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lead-free soldering paste Sn96.5Ag3Cu0.5
lead-free soldering paste Sn96.5Ag3Cu0.5 tin soldertin solder paste flux solder paste
|Name||Lead-free solder paste|
|Particles 3#||25 - 45μm(custom made)|
|Particles 4#||20 - 38μm(custom made)|
|Lead solder paste||SN50/PB50||183||3#||4#||No cleaning LED field|
|SN55/PB45||183||3#||4#||No cleaning LED field|
|SN60/PB40||183||3#||4#||Lead Containment PCB Reflow|
|SN60/PB40||80.00%||183||3#||Reflow soldering of stainless steel, aluminum, copper, iron, common metal alloys|
|SN63/PB37||90.00%||183||3#||4#||Lead Containment PCB Reflow|
|SN42/BI58||90.00%||138||3#||4#||Low temperature reflow soldering|
|Lead-free solder paste||SN99/AG0.3/CU0.7||88.50%||221||3#||4#||Lead-free Containment PCB Reflow|
|SN99/AG0.3/CU0.7||88.50%||221||3#||4#||Halogen-free, no-clean, good wetting, suitable for precision PCB soldering|
|SN96.5/AG3/CU0.5||88.50%||217||3#||4#||Lead-free Containment PCB Reflow|
|SN96.5/AG3/CU0.5||88.50%||217||3#||4#||Zero Halogen No-Clean, Good Wet Moisture Suitable for High-Precision PCB Reflow Soldering|
Solder paste grades
There are various grades of solder paste and the required type can be selected to fit in with the PCB assembly process used. The solder paste is graded according to the size of the small solder balls. As they cannot be exactly graded, the different types have a band of solder ball sizes between which 80% of the minute solder balls fall.
|IPC TYPE DESIGNATION||PARTICLE SIZE (ΜM) *|
|Type 1||75 - 150|
|Type 2||45 - 75|
|Type 3||25 - 45|
|Type 4||20 - 38|
|Type 5||10 - 25|
|Type 6||5 - 15|
|Type 7||2 - 11|
|Type 8||2 - 8|
* 80% minimum between the stated sizes
Solder can also be categorised according to the type of flux used:
In order to ensure that the solder paste is suitable for proving the highest performance for PCB assembly it is necessary to ensure that it maintains the required properties. To achieve this it is imperative that the solder paste is stored correctly. It should always be stored in an airtight container to prevent oxidation. The very large surface area of the minute solder spheres, means that oxidation can present a very great problem.
Additionally, the solder must be stored at low temperatures. Not only does this reduce the rate of any oxidation there may be, but it also reduces the rate at which the flux degrades. While a low temperature is imperative, it should not be stored at a temperature below freezing.
In view of the way in which solder paste can degrade, it also has a defined shelf life and it should not be used after its end date. If old solder paste is used there is a distinct risk of a much higher defect rate, and the cost of any rework incurred would be well beyond the cost of replacing the solder paste.
When solder paste is used in mass PCB assembly as well as prototype PCB assembly there are a number of stages that are undertaken. First solder paste is applied to the printed circuit boards. The solder paste is only applied to the areas where solder is required. This is achieved using a solder paste stencil that only allows the solder paste through in certain areas.
There are many ways of achieving this, but typically a stencil is placed over the board, and the paste is applied though this, ensuring that the required amount is applied - too little and the joints will have sufficient solder - too much and the joints will be too large and there may be the possibility of poor joints and even shorts between adjacent pads, etc.
Once the solder paste has been applied to the printed circuit board, it is then passed into the pick and place machine where the components are added. The solder paste has sufficient tension that it holds the components in place. However care should be taken not to knock the board at this stage otherwise the components may move of fall off. Additionally the board should be soldered within a few hours of being placed, otherwise the solder paste may deteriorate.
1.Short lead time;
3.All size and model available.
Flason SMT are long term and stable supplier of above stated SMT Equipment.
Flason SMT will Provide high quality and low price goods and perfect follow-up service.
SMT Peripheral Equipment, PCB loader, PCB unloader, PCB conveyor, PCB cleaner, Nozzle cleaner, PCB destacker loader, Reflow Oven thermal profiler, PCB NG/OK machine, DIP insert line, Solder paste mixer, SMT Stencil Cleaning machine.
Flason Electronic Co, Ltd provide a full SMT Assembly Line solutions, including SMT reflow oven, Wave Soldering Machine, Pick and Place Machine, solder paste printer, PCB loader, PCB unloader, SMT AOI Machine, SMT SPI Machine, SMT X-Ray machine, SMT assembly line equipment, smt spare parts etc, any kind SMT machines you may need, please contact us by: wechat whatsapp:+86 13691605420, Skype: flasonsmt, Email: [email protected]
1) This is the first time I use this kind of machine, is it easy to operate?
There is English manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.
2) If machine have any problem after I receive it, how can I do ?
Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
3) MOQ ?
1 set machine, mixed order is also welcomed.
4) How can I buy this machine from you? ( Very easy and flexible !)
A. Consult us about this product on line or by e-mail.
B. Negotiate and confirm the final price , shipping , payment methods and other terms.
C. Send you the proforma invoice and confirm your order.
D. Make the payment according to the method put on proforma invoice.
E. We prepare for your order in terms of the proforma invoice after confirming your full payment.
And 100% quality check before shipping.
F.Send your order by air or by sea.
5)Why choose us ?
A. Gold supplier on Alibaba !
B. Trade assurance to US$100,000 !
C. Best price & Best shipping & Best service !
Phone: +86 13691605420
Email: [email protected]
Add: No.94, Guangtian Road, Songgang Street, Baoan District Shenzhen